Substrate-Compatible Inline System BM-2100SI Plus
Features stable solder ball mounting and improves productivity through an inline system.
Integrating inspection and repair processes inline with a micro ball mounter compatible with substrates and panels. This achieves greater efficiency and significant productivity improvements on the production line. 【Features】 ■ An inline system that widely adapts to PCB and BGA size substrates for mounting, inspection, and repair of micro balls. ■ Fully automated production that does not touch the substrate, from material feeding to removal. ■ Improved productivity by processing each step in parallel. ■ Flexible connection with reflow and flux cleaning processes. *For more details, please refer to the PDF document or feel free to contact us.
- 企業：日精 本社
- 価格：Other
